Cray XD1 Supercomputer Delivers Unmatched Performance When Running LSTC’s LS-DYNA Simulation Software

This is mostly an advertising news release, but it was interesting (at least to me) for one of the listed applications – simulating metal stamping. I assume they mean simulating metal deformation in a stamping application, because straight stamping holes in steel wouldn’t need this kind of computer power.

Most people here won’t know it, but in a previous career I was a systems programmer, and one of the computer systems I supported was a front-end processor for a Cray. In those days, Crays didn’t do their own input/output to “slow” devices like line printers, card readers and networks, so a smaller, “cheaper” computer like mine did all the legwork. At that time, Crays were multi-million dollar machines that only universities, research institutes and spy agencies could afford. This one, it seems, goes for “only” $100,000. My how things have changed!

Yahoo! Finance – Press Release

SEATTLE, WA and LIVERMORE, CA–(MARKET WIRE)–Apr 18, 2005 — Global supercomputer leader Cray Inc. and Livermore Software Technology Corp. today announced that the Cray XD1(TM) Opteron(TM)/Linux-based supercomputer has significantly outperformed all other systems running LSTC’s popular LS-DYNA computer-aided engineering (CAE) code, according to benchmark results reported by Cray, Hewlett-Packard, IBM and other high-performance computing (HPC) vendors. In addition, LSTC announced that it has certified LS-DYNA for operation on the Cray XD1 system.

In several tests designed to measure how well systems perform when using LS-DYNA to solve industrial problems, the Cray XD1 supercomputer delivered superior turnaround times — a key requirement for CAE users committed to shortening their product design cycles — compared to results reported for alternative systems.

Dr. John Hallquist, president, LSTC, said “The Cray XD1 supercomputer makes our code even more valuable to the engineers who use it to simulate collisions, structural deformations and failures, metal stamping, armor penetration and other complex, real-world materials problems. Now those engineers have a solution that provides optimal performance, functionality and scalability.”

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